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Hot Selling FR4 Customization AOI Test Smt Manufacturing High Quality PCB For Telecommunication

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Hot Selling FR4 Customization AOI Test Smt Manufacturing High Quality PCB For Telecommunication
Характеристики Галерея Характер продукции Спросите цитату
Характеристики
Характеристики
Model Number: Customer Model
Base Material: FR4,Aluminum,Middle tg FR4,Hi-Tg FR4
Copper Thickness: 0.25- 6OZ
Board Thickness: 0.05-5.0mm
Min. Hole Size: 8mil(0.2mm) 3mil(0.075mm)
Min. Line Width: 0.05mm (2mil)
Min. Line Spacing: 0.05mm (2mil)
Surface Finishing: ENIG, HASL, OSP
Board Size: Color: Green,Blue,Black, White, Red and others
PCB Standard: IPC-A-600, IPC-6012
PCB Special Process: Buried Hole, Blind Hole, Embedded Resistance
PCB Min. impedance tolerance: ±5%
PCB Min. BGA spacing: 0.075mm
Aspect Ratio: 18/1
Board size: 100*100mm to 508*762mm
Board hardness: 6h
Testing: AOI Test,E-test,Functional test
Certificate: ISO9001/ISO13485/IATF16949/ROHS
Package: Inner vacuum or plastic package,outer Carton box package
Основная информация
Сертификация: ISO9001/ISO13485/IATF16949/ROHS
Model Number: Customer Model
Оплата и доставка Условия
Packaging Details: Inner vacuum or plastic package,outer Carton box package
Supply Ability: 100000 Unit/Units per Week
Характер продукции
item
value
Model Number
Customer Model
Place of Origin
China
Brand Name
Suteng
Base Material
FR4,Aluminum,Middle tg FR4,Hi-Tg FR4
Copper Thickness
0.25- 6OZ
Board Thickness
0.05-5.0mm
Min. Hole Size
8mil(0.2mm) 3mil(0.075mm)
Min. Line Width
0.05mm (2mil)
Min. Line Spacing
0.05mm (2mil)
Surface Finishing
ENIG, HASL, OSP
Board Size
Color: Green,Blue,Black, White, Red and others
PCB Standard
IPC-A-600, IPC-6012
PCB Special Process
Buried Hole, Blind Hole, Embedded Resistance
PCB Min. impedance tolerance
±5%
PCB Min. BGA spacing
0.075mm
Aspect Ratio
18/1
Board size
100*100mm to 508*762mm
Board hardness
6h
Testing
AOI Test,E-test,Functional test
Certificate
ISO9001/ISO13485/IATF16949/ROHS/SGS
Package
Inner vacuum or plastic package,outer Carton box package
Product description
Model Number:
According to customers
Surface Finishing:
ENIG，HASL,OSP
Supplier Type:
Manufacturer
PCB/PCBA Testing:
AOI Test, E-test, Functional test
Base Material:
FR4, Aluminum, Mid-tg FR4, Hi-Tg FR4
Package:
Inner vacuum or plastic package, outer Carton box package
Layer Count:
1～36ayers
PCB Standard:
IPC-A-600, IPC-6012
Copper Thickness:
0.25- 6OZ
Certificate:
ISO9001/ISO13485/IATF16949/ROHS/SGS
Board Thickness:
0.05～5.0mm
Brand Name:
Hangzhou Suteng Circuit
Min. Line Spacing:
0.05mm (2mil)
PCB/PCBA service:
One Stop Turnkey PCB/PCBA Service
Min. Line Width:
0.05mm (2mil)
Place of Origin:
Zhejiang,China
Min Hole Diameter:
0.075mm
Service:
PCB，PCBA, Box build
Solder mask color:
Green,Blue,Black, White, Red and more
MOQ:
1pcs
Solder mask hardness:
6H
Logistic:
Express, air or sea
PCB capabilities
Layers
1～36ayers
Max. Thickness
6OZ
Max. Board Thickness
5.0mm
Min. Board Thickness
0.05 mm
Base Material
FR4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide
Min. Width/Spacin
Inner layer: 2mil/2mil (HOZ), Outer layer: 3mil/3mil(1OZ)
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Maximum Board Size
508× 762mm
Minimum plate size
100× 100mm
Aspect Ratio
18:01
Surface Finish
HASL, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control.
Min. impedance tolerance
±5%
Min. BGA spacing
0.075mm
PCBA capacity
Automatic Printer
Base size :458mm(L)X356mm(W)大50mm(L)X50 mm(W)
Min speed: 1~300mm/s
Accuracy: ±0.025mm
SMT
Speed: 40000cpH 0.09Second
PCB size: 460(L) x 400(W) 510(L) x 460(W) (Optional), 610(L) x 510(W)(Optional), 740(L) x 460(W)(Optional)
Size: Min 0201, Max30X30inch
Blow height 25.4mm
PCB thickness: 0.38-4.2mm
SMT capacity: 3Million welding spot/day
Base type: POP/Board/FPC/Rigid-Flex/Metal base
Attrition rat: Resistor-Capacitor 0.3%, IC 0%
Accuracy: ±0.04mm
Reflow oven
PCB max width: 270mm×2(Single channel 50-490mm)
Heating time: 30mins
Temperature: room -300°C
Speed: 300-2000mm/min
Fault warning: low or high temperature, voice or light warning
Heat/cool zone: Up 10\down 10 heating zone, up 2 cooling zone
Reflow: lead solder, lead free solder
AOI
PCB size: 450mm(L)X400mm(W) , big 50mm(L)X50mm(W). Min thickness:1mm~3mm
FOV/Resolution: 4Megan Pixels FOV:37.237.2mm Resolution:18.2um/pixel
Speed: 4.940mX4.940m/Sec
Min: 0201chip/0.4pitch IC(mm)
Wave soldering machine
Pre heating: below15mins
Temperature: room -280°C
PCB width:50~350mm
Base bottom space: Up 120mm, Down 25mm
Speed: 0-1800mm/min
Pre heating No. & method :3 bottom hot wind pre heating
Temperature control of pre heating: PID closed loop control+SSR drive
Control method: Auto computer control, Windows7
Spray system: built-in air-blast atomizer
Transport claw: titanium alloy double claw
Solder pot running method: mechanical
Cooling method: Air cooling
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